Wireless devices need to perform reliably, not only in real-world RF environments but also under extreme temperature conditions.
Together with our partner DVTEST, we offer a solution that combines OTA (Over-the-Air) measurements with thermal testing inside large RF test chambers. By integrating the ThermaSafe™ Air Transparent Thermal Enclosure with an external forced-air thermal system, engineers can evaluate wireless devices and antenna performance across a wide temperature range without affecting shielding effectiveness or anechoic chamber performance.
This approach helps accelerate product development, reliability testing, design validation, and compliance assessments in a single test setup.